Payment & Shipping Terms:
|Minimum Order Quantity||100|
|Delivery Time||4 weeks|
|Payment Terms||T/T, LC|
|Packaging Details||Carton and Wood|
Sealed Carrier - Multilayer thin-wire substrate assembly is a component that uses high-density interconnect and assembly technology. The advantage of this kind of assembly is: Can use various substrates (such as ceramic substrate, glazed steel substrate, printed circuit board and phenolic board, etc.); Sensitive chip can be encapsulated in a sealed carrier, the package does not require large packages, the volume Weight is much smaller than the hybrid circuit; processability, debugability, maintainability is good; good heat dissipation; gas-phase remelting technology can be installed on both sides of the substrate carrier to improve the assembly density.